Ni-29Mn-21.5Ga (at. %) wires are fabricated via a combination of (i) extrusion of liquid inks containing a binder, solvents, and elemental Ni, Mn, and Ga powders and (ii) heat treatments to remove the polymer binder and to interdiffuse and sinter the powders. To study the microstructural evolution, sintering mechanisms, and grain growth in these wires, both ex situ metallography and in situ X-Ray tomography were conducted while sintering at 800–1050 °C for up to 4 h. After debinding, Ga-rich regions melt and induce transient liquid phase sintering of the surrounding Ni and Mn powders, resulting in localized swelling of the wires and…
Ni-Mn-Ga magnetic shape memory alloy (SMA) micro-trusses, suitable for high magnetic field induced strains and/or a large magnetocaloric effect, are created via a new additive manufacturing method combining (i) 3D-printing ∼400 μm struts with an ink containing a polymer binder and elemental Ni, Mn, and Ga powders, (ii) binder burn-out and metallic powder interdiffusion and homogenization to create the final alloy, and (iii) further sintering to increase strut density. Controlled amounts of hierarchical porosity, desirable to enable twinning in this polycrystalline alloy, are achieved: (i) continuous ∼450 μm channels between the printed Ni-Mn-Ga ∼300 μm diameter struts (after sintering) and…